INTERNATIONAL PATENT: INTEL CORPORATION FILES APPLICATION FOR "PLATFORM-INTEGRABLE INTERCONNECTS FOR CONTACTLESS COUPLING OF COMPUTER MODULES"

GENEVA, Jan. 6 -- INTEL CORPORATION (2200 Mission College BoulevardSanta Clara, California 95054) filed a patent application (PCT/US2024/035932) for "PLATFORM-INTEGRABLE INTERCONNECTS FOR CONTACTLESS COUPLING OF COMPUTER MODULES" on Jun 28, 2024. With publication no. WO/2026/005782, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): YANG, Tae Young (c/o Intel Corporation2200 Mission College BoulevardSanta Clara, California 95054), YAMADA, Shuhei (c/o Intel Corporation2200 Mission College BoulevardSanta Clara, California 9505...