INTERNATIONAL PATENT: INTEL CORPORATION FILES APPLICATION FOR "INTEGRATED CIRCUIT PACKAGE WITH COMPOSABLE NETWORK ARCHITECTURE"

GENEVA, May 12 -- INTEL CORPORATION (2200 Mission College BoulevardSanta Clara, California 95054) filed a patent application (PCT/US2025/033998) for "INTEGRATED CIRCUIT PACKAGE WITH COMPOSABLE NETWORK ARCHITECTURE" on Jun 17, 2025. With publication no. WO/2026/096002, the details related to the patent application was published on May 07, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KALSI, Gurpreet S. (6474 NW Connery TerPortland, Oregon 97229), WANG, Hong (4049 Marston LaneSanta Clara, California 95054), KLOWDEN, Daniel (2507 NE 13th AvenuePortland, Oregon 97212), HOWARD, Jason (1931 SW 1...