International Patent: INTEGRATED PACKAGING MODULE WITH POWER SEMICONDUCTOR EMBEDDED INTO COPPER-CLAD HIGH-THERMAL-CONDUCTIVITY INSULATING MATERIAL

GENEVA, July 1 -- SHENZHEN HAISHENG RUI TECHNOLOGY CO., LTD. filed a patent application (CN2026/073741) for “INTEGRATED PACKAGING MODULE WITH POWER SEMICONDUCTOR EMBEDDED INTO COPPER-CLAD HIGH-THERMAL-CONDUCTIVITY INSULATING MATERIAL”. With publication no. WO/2026/124688, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05K 1/185

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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