International Patent: INTEGRATED HIGH-DENSITY POWER DELIVERY AND LIQUID JET IMPINGEMENT COOLING SYSTEM FOR WAFER-SCALE COMPUTING

GENEVA, July 6 -- SILVERBROOK, Kia filed a patent application (IB2025/063508) for “INTEGRATED HIGH-DENSITY POWER DELIVERY AND LIQUID JET IMPINGEMENT COOLING SYSTEM FOR WAFER-SCALE COMPUTING”. With publication no. WO/2026/139939, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 40/47

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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