GENEVA, July 6 -- QUALCOMM INCORPORATED filed a patent application (US2025/058846) for “INTEGRATED CIRCUITS (ICS) INCLUDING POWER AMPLIFIER CIRCUITS AND BACK SIDE PASSIVE COMPONENTS AND METHODS OF MAKING”. With publication no. WO/2026/142853, here are the other details related to the patent application:
Kind: Initial Publication without ISR [A2]
IPC: H10W 44/20
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Disclaimer: Curated by HT Syndication....