International Patent: INTEGRATED CIRCUIT (IC) PACKAGE HAVING A PACKAGE MOLD LAYER BETWEEN A DIE AND A SUBSTRATE COMPRISING TWO TYPES OF RESIN TO IMPROVE COUPLING OF DIE INTERCONNECTS HAVING DIFFERENT SIZES

GENEVA, July 6 -- QUALCOMM INCORPORATED filed a patent application (US2025/058848) for “INTEGRATED CIRCUIT (IC) PACKAGE HAVING A PACKAGE MOLD LAYER BETWEEN A DIE AND A SUBSTRATE COMPRISING TWO TYPES OF RESIN TO IMPROVE COUPLING OF DIE INTERCONNECTS HAVING DIFFERENT SIZES”. With publication no. WO/2026/142854, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H10W 70/685

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Disclaimer: Curated by HT Syndication....