International Patent: INSULATING RESIN WITH IMPROVED DUCTILITY AND BUILD-UP FILM USING SAME

GENEVA, Aug. 14 -- HANWHA E-SSENTIAL CORPORATION filed a patent application (KR2026/002087) for “INSULATING RESIN WITH IMPROVED DUCTILITY AND BUILD-UP FILM USING SAME”. With publication no. WO/2026/168975, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: C08L 63/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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