International Patent: IMPLANTABLE MEDICAL DEVICE WITH A CONDUCTIVE LAYER HAVING A BONDING RIM FOR COUPLING TO A FLUIDIC MANIFOLD

GENEVA, Sept. 18 -- BOSTON SCIENTIFIC SCIMED, INC. filed a patent application (US2026/016871) for “IMPLANTABLE MEDICAL DEVICE WITH A CONDUCTIVE LAYER HAVING A BONDING RIM FOR COUPLING TO A FLUIDIC MANIFOLD”. With publication no. WO/2026/187576, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: A61M 1/00

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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