INTERNATIONAL PATENT: IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS / LEIBNIZ-INSTITUT FUR INNOVATIVE MIKROELEKTRONIK FILES APPLICATION FOR "BIOSENSOR COMPRISING A SENSOR WAFER WITH BACKSIDE ETCHED RECESSES COMPLEMENTARY TO THE FRONT SIDE ETCHED RECESSES OF A MICROFLUIDIC WAFER"

GENEVA, July 8 -- IHP GMBH - INNOVATIONS FOR HIGH PERFORMANCE MICROELECTRONICS / LEIBNIZ-INSTITUT FUR INNOVATIVE MIKROELEKTRONIK (Im Technologiepark 2515236 Frankfurt (Oder)) filed a patent application (PCT/EP2024/085395) for "BIOSENSOR COMPRISING A SENSOR WAFER WITH BACKSIDE ETCHED RECESSES COMPLEMENTARY TO THE FRONT SIDE ETCHED RECESSES OF A MICROFLUIDIC WAFER" on Dec 10, 2024. With publication no. WO/2025/140846, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): STEGLICH, Patrick (c/o IHP GmbH - Innovations for High Perf...