INTERNATIONAL PATENT: IHI CORPORATION, 株式会社ＩＨＩ FILES APPLICATION FOR "WELDING CONDITION DETERMINATION DEVICE AND WELDING CONDITION DETERMINATION METHOD"

GENEVA, April 19 -- IHI CORPORATION (1-1, Toyosu 3-chome, Koto-ku, Tokyo1358710), 株式会社ＩＨＩ (東京都江東区豊洲三丁目１番１号) filed a patent application (PCT/JP2025/019115) for "WELDING CONDITION DETERMINATION DEVICE AND WELDING CONDITION DETERMINATION METHOD" on May 27, 2025. With publication no. WO/2026/078921, the details related to the patent application was published on Apr 16, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TORIGATA, Keisuke (c/o IHI C...