GENEVA, March 9 -- HYDRASPECMA A/S (Baekgardsvej 366900 Skjern) filed a patent application (PCT/DK2024/050198) for "A COOLING DEVICE AND A METHOD FOR COOLING A POWER MODULE" on Aug 27, 2024. With publication no. WO/2026/046484, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): RASMUSSEN, Ole Fosgrau (Ny Kirkevej 58680 Ry), RAHR, Soren Sebjerg (Agervangen 158464 Galten)
Abstract: Disclosed is a cooling device (14) comprising a baseplate (3) having a cavity (2) extending from a connection surface (4) of the baseplate (3) and...