GENEVA, Dec. 28 -- HYC (CHENGDU) TECHNOLOGY CO., LTD. (288#, Kang Qiang Yi Road, High-Tech DistrictChengdu, Sichuan 611730), 华兴源创（成都）科技有限公司 (中国四川省成都市高新区康强一路288号) filed a patent application (PCT/CN2024/139191) for "METHOD AND APPARATUS FOR CORRECTING THICKNESS OF FILM LAYER, AND COMPUTER DEVICE" on Dec 13, 2024. With publication no. WO/2025/260651, the details related to the patent application was published on Dec 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which ...