INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD. FILES APPLICATION FOR "METHOD, APPARATUS AND SYSTEM OF CIRCULAR BUFFERING FOR PROBABILISTIC AMPLITUDE SHAPING"

GENEVA, Oct. 12 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129) filed a patent application (PCT/CN2024/112012) for "METHOD, APPARATUS, AND SYSTEM OF CIRCULAR BUFFERING FOR PROBABILISTIC AMPLITUDE SHAPING" on Aug 14, 2024. With publication no. WO/2025/208763, the details related to the patent application was published on Oct 09, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): VU, Van Hung (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), ZHANG, Huazi (Huawei Administration Building, B...