INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD. FILES APPLICATION FOR "HIGH-SPEED COMPACT-IN-SIZE INTERCONNECT BETWEEN TRANSMITTING AND RECEIVING ANTENNAS IN USER EQUIPMENT"

GENEVA, Feb. 20 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129) filed a patent application (PCT/CN2024/112769) for "HIGH-SPEED COMPACT-IN-SIZE INTERCONNECT BETWEEN TRANSMITTING AND RECEIVING ANTENNAS IN USER EQUIPMENT" on Aug 16, 2024. With publication no. WO/2026/036389, the details related to the patent application was published on Feb 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KARKI, Sabin Kumar (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), YAO, Yu (Huawei Administrat...