GENEVA, March 8 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129) filed a patent application (PCT/CN2025/107296) for "FIBER SHAPE MEASUREMENT METHOD AND APPARATUS" on Jul 07, 2025. With publication no. WO/2026/045684, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): JIANG, Zhiping (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), BRAGA, Pedro Tovar (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, ...