INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., TSOI, VADIM FILES APPLICATION FOR "COOLING ARRANGEMENT FOR COOLING AN ELECTRICAL HEAT SOURCE"

GENEVA, Nov. 10 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building BantianLonggang DistrictShenzhen, Guangdong 518129), TSOI, Vadim (Huawei Technologies Sweden ABSkalholtsgatan 916440 Kista) filed a patent application (PCT/EP2024/061919) for "COOLING ARRANGEMENT FOR COOLING AN ELECTRICAL HEAT SOURCE" on Apr 30, 2024. With publication no. WO/2025/228514, the details related to the patent application was published on Nov 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building BantianLonggang DistrictShenzhen, Guangdong 518...