INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., MAULE, MASSIMILIANO FILES APPLICATION FOR "NETWORK SLICING DEVICE, METHOD AND SYSTEM"

GENEVA, June 16 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building BantianLonggang DistrictShenzhen, Guangdong 518129), MAULE, Massimiliano (Huawei Technologies Duesseldorf GmbH Riesstr. 2580992 Munich) filed a patent application (PCT/EP2023/084773) for "NETWORK SLICING DEVICE, METHOD AND SYSTEM" on Dec 07, 2023. With publication no. WO/2025/119483, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CAO, Hanwen (Huawei Technologies Duesseldorf GmbH Riesstr. 2580992 Munich), STIRLING-GALLACHER, Richard (Huawei T...