GENEVA, June 16 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building BantianLonggang DistrictShenzhen, Guangdong 518129), KOBUS, Tadeusz (Huawei Technologies Duesseldorf GmbHRiesstr. 2580992 Munich) filed a patent application (PCT/EP2023/084554) for "IMPROVING THE MANAGEMENT OF A BUFFER OF A MEMORY MODULE THROUGH COORDINATION WITH THE CPU CACHE" on Dec 06, 2023. With publication no. WO/2025/119465, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KOKOCIŃSKI, Maciej (Huawei Technologies Duesseldorf GmbHRies...