INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., HADID, ABDENOUR FILES APPLICATION FOR "DETERMINATION OF THE LEVEL AND/OR SOURCE OF PAIN FROM MICRO-EXPRESSIONS USING MACHINE LEARNING"

GENEVA, June 16 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building BantianLonggang DistrictShenzhen, Guangdong 518129), HADID, Abdenour (Huawei Technologies Sweden ABSkalholtsgatan 916440 Kista) filed a patent application (PCT/EP2023/084437) for "DETERMINATION OF THE LEVEL AND/OR SOURCE OF PAIN FROM MICRO-EXPRESSIONS USING MACHINE LEARNING" on Dec 06, 2023. With publication no. WO/2025/119458, the details related to the patent application was published on Jun 12, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building Bantia...