INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., CURATOLA, GILBERTO FILES APPLICATION FOR "MULTI-STACK LAYER FOR USE IN A FIELD-EFFECT TRANSISTOR"

GENEVA, March 23 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building BantianLonggang DistrictShenzhen, Guangdong 518129), CURATOLA, Gilberto (Huawei Technologies Duesseldorf GmbHRiesstr. 2580992 Munich) filed a patent application (PCT/EP2024/075615) for "MULTI-STACK LAYER FOR USE IN A FIELD-EFFECT TRANSISTOR" on Sep 13, 2024. With publication no. WO/2026/057167, the details related to the patent application was published on Mar 19, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building BantianLonggang DistrictShenzhen, Guang...