INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., 华为技术有限公司 FILES APPLICATION FOR "SEMICONDUCTOR STRUCTURE MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE AND ELECTRONIC APPARATUS"

GENEVA, July 28 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2025/071549) for "SEMICONDUCTOR STRUCTURE MANUFACTURING METHOD, SEMICONDUCTOR STRUCTURE, ELECTRONIC DEVICE, AND ELECTRONIC APPARATUS" on Jan 09, 2025. With publication no. WO/2025/152849, the details related to the patent application was published on Jul 24, 2025.

Notably, the patent application was submitted under the International Patent Classifi...