GENEVA, Oct. 12 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2024/139692) for "SEMICONDUCTOR DEVICE AND PREPARATION METHOD, AND PACKAGING STRUCTURE AND ELECTRONIC DEVICE" on Dec 16, 2024. With publication no. WO/2025/208930, the details related to the patent application was published on Oct 09, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, whi...