INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., 华为技术有限公司 FILES APPLICATION FOR "PACKAGE SUBSTRATE AND PREPARATION METHOD THEREFOR, SEMICONDUCTOR STACK STRUCTURE AND ELECTRONIC DEVICE"

GENEVA, March 29 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2025/107473) for "PACKAGE SUBSTRATE AND PREPARATION METHOD THEREFOR, SEMICONDUCTOR STACK STRUCTURE, AND ELECTRONIC DEVICE" on Jul 08, 2025. With publication no. WO/2026/061105, the details related to the patent application was published on Mar 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IP...