INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., 华为技术有限公司 FILES APPLICATION FOR "HEAT PIPE MEMBER, THREE-DIMENSIONAL VAPOR CHAMBER MODULE, HEAT DISSIPATION APPARATUS AND ELECTRONIC DEVICE"

GENEVA, March 16 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2025/093479) for "HEAT PIPE MEMBER, THREE-DIMENSIONAL VAPOR CHAMBER MODULE, HEAT DISSIPATION APPARATUS, AND ELECTRONIC DEVICE" on May 08, 2025. With publication no. WO/2026/051402, the details related to the patent application was published on Mar 12, 2026.

Notably, the patent application was submitted under the International Patent Classification...