INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., 华为技术有限公司 FILES APPLICATION FOR "CONNECTION FILM AND MANUFACTURING METHOD THEREFOR AND SEMICONDUCTOR PACKAGING STRUCTURE AND PACKAGING METHOD THEREFOR"

GENEVA, Jan. 17 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration BuildingBantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2025/073628) for "CONNECTION FILM AND MANUFACTURING METHOD THEREFOR, AND SEMICONDUCTOR PACKAGING STRUCTURE AND PACKAGING METHOD THEREFOR" on Jan 21, 2025. With publication no. WO/2026/011743, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classi...