GENEVA, Feb. 22 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼) filed a patent application (PCT/CN2025/086240) for "CHIP PACKAGE-ON-PACKAGE AND MANUFACTURING METHOD THEREFOR, AND ELECTRONIC DEVICE" on Mar 31, 2025. With publication no. WO/2026/036737, the details related to the patent application was published on Feb 19, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is mana...