INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., 华为技术有限公司, SHENZHEN UNITED BLUEOCEAN APPLIED MATERIAL TECHNOLOGY CO., LTD, 深圳市联合蓝海应用材料科技股份有限公司 FILES APPLICATION FOR "ELECTROPLATING SOLUTION FOR GOLD-SILVER ALLOY AND USE THEREOF"

Posted On: 2026-02-16

GENEVA, Feb. 16 -- HUAWEI TECHNOLOGIES CO., LTD. (Huawei Administration Building, Bantian, Longgang DistrictShenzhen, Guangdong 518129), 华为技术有限公司 (中国广东省深圳市龙岗区坂田华为总部办公楼), SHENZHEN UNITED BLUEOCEAN APPLIED MATERIAL TECHNOLOGY CO., LTD (7/f, Halo Plaza III, Bao'an North Road, Luohu DistrictShenzhen, Guangdong 518002), 深圳市联合蓝海应用材料科技股份有限公司 (中国广东省深圳市罗湖...

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INTERNATIONAL PATENT: HUAWEI TECHNOLOGIES CO., LTD., 华为技术有限公司, SHENZHEN UNITED BLUEOCEAN APPLIED MATERIAL TECHNOLOGY CO., LTD, 深圳市联合蓝海应用材料科技股份有限公司 FILES APPLICATION FOR "ELECTROPLATING SOLUTION FOR GOLD-SILVER ALLOY AND USE THEREOF"