GENEVA, July 2 -- BIOBOND ADHESIVES, INC. filed a patent application (US2025/060188) for “HOT-MELT PRESSURE SENSITIVE ADHESIVE COMPOSITION AND METHOD OF APPLICATION”. With publication no. WO/2026/136587, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C09J 11/06
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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