GENEVA, June 19 -- CORNING INCORPORATED filed a patent application (US2025/053286) for “HONEYCOMB SUBSTRATE HAVING HIGH POROSITY AND SURFACE AREA AND METHOD OF MAKING SAME”. With publication no. WO/2026/106803, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: B01J 20/28
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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