INTERNATIONAL PATENT: HITACHI HIGH-TECH CORPORATION, 株式会社日立ハイテク FILES APPLICATION FOR "DEVICE AND METHOD FOR CUTTING FOR SHEET-LIKE MEMBER AND LAMINATED BATTERY MANUFACTURING DEVICE IN WHICH SAID CUTTING DEVICE IS USED"

GENEVA, Dec. 22 -- HITACHI HIGH-TECH CORPORATION (17-1, Toranomon 1-chome, Minato-ku, Tokyo1056409), 株式会社日立ハイテク (東京都港区虎ノ門一丁目１７番１号) filed a patent application (PCT/JP2025/008309) for "DEVICE AND METHOD FOR CUTTING FOR SHEET-LIKE MEMBER, AND LAMINATED BATTERY MANUFACTURING DEVICE IN WHICH SAID CUTTING DEVICE IS USED" on Mar 06, 2025. With publication no. WO/2025/258158, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is mana...