GENEVA, Feb. 10 -- HIRAKAWA HEWTECH CORPORATION (4-17-5 Shiba, Minato-ku, Tokyo1080014), 平河ヒューテック株式会社 (東京都港区芝４－１７－５) filed a patent application (PCT/JP2025/026460) for "RESIN COMPOSITION, INSULATED WIRE USING RESIN COMPOSITION, COMMUNICATION CABLE, METHOD FOR PRODUCING INSULATED WIRE, AND USE OF RESIN COMPOSITION" on Jul 25, 2025. With publication no. WO/2026/028948, the details related to the patent application was published on Feb 05, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the Worl...