International Patent: HIGH-DENSITY OPTICAL CONNECTOR AND OPTICAL MODULE INCLUDING THE SAME

GENEVA, July 1 -- SENKO ADVANCED COMPONENTS, INC. filed a patent application (US2025/058863) for “HIGH-DENSITY OPTICAL CONNECTOR AND OPTICAL MODULE INCLUDING THE SAME”. With publication no. WO/2026/128528, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: G02B 6/38

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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