INTERNATIONAL PATENT: HI-TECH WIRES ASIA CO., LTD, INNOV-GROUP FILES APPLICATION FOR "CUTTING MACHINE USING A DIAMOND WIRE"

GENEVA, Nov. 24 -- HI-TECH WIRES ASIA CO., LTD (46 Street No. 6Singapore Industrial ParkBinh Duong Thuan AnBinh Duong Thuan An), INNOV-GROUP (209 A avenue Berthelot69007 LYON) filed a patent application (PCT/EP2025/062508) for "CUTTING MACHINE USING A DIAMOND WIRE" on May 07, 2025. With publication no. WO/2025/237776, the details related to the patent application was published on Nov 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): POURADIER, Jean-Baptiste (c/o HI-TECH WIRES ASIA CO., LTD46 Street No. 6Singapore Industrial ParkBinh Duong Thuan AnBinh Duong Thuan An), NGUYỄN, Đo...