GENEVA, July 6 -- RESONAC CORPORATION filed a patent application (JP2025/044398) for “HEXAGONAL BORON NITRIDE FILLER, PRODUCTION METHOD FOR HEXAGONAL BORON NITRIDE FILLER, RESIN COMPOSITION, AND PRODUCTION METHOD FOR RESIN COMPOSITION”. With publication no. WO/2026/141151, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C01B 21/064
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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