GENEVA, March 2 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Dusseldorf) filed a patent application (PCT/EP2025/070802) for "THERMALLY DEBONDABLE ONE-COMPONENT POLYUREA ADHESIVE COMPOSITION" on Jul 21, 2025. With publication no. WO/2026/041321, the details related to the patent application was published on Feb 26, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MIGLIORE, Nicola (Velberter StraBe 3040227 Dusseldorf), KOHLSTRUNG, Rainer (GoethestraBe 2/168723 Plankstadt), FRANKEN, Uwe (HaselnuBweg 441542 Dormagen)
Abstract: The present invention relates to a thermally debondable one-compone...