INTERNATIONAL PATENT: HENKEL AG & CO. KGAA FILES APPLICATION FOR "BONDED STRUCTURE COMPRISING AN THERMALLY DEBONDABLE ADHESIVE FILM"

GENEVA, Dec. 22 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Dusseldorf) filed a patent application (PCT/EP2025/063334) for "BONDED STRUCTURE COMPRISING AN THERMALLY DEBONDABLE ADHESIVE FILM" on May 15, 2025. With publication no. WO/2025/256855, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): MIGLIORE, Nicola (Velberter StraBe 3040227 Dusseldorf), GUTSCHE, Nadine (Am Strauch 2240723 Hilden), GOETHEL, Frank (Am Steinberg 5709125 Chemnitz), FRANKEN, Uwe (HaselnuBweg 441542 Dormagen), KOHLSTRUNG, Rainer (GoethestraBe 2/168...