GENEVA, Dec. 21 -- HENKEL AG & CO. KGAA (Henkelstrasse 67 Duesseldorf40589), HENKEL ADHESIVE TECHNOLOGIES (SHANGHAI) CO., LTD. (No. 928 Zhangheng RoadPudong New Area, Shanghai 201203) filed a patent application (PCT/CN2024/098425) for "COMPOSITION AND PROCESS FOR SEALING ANODIZED ALUMINUM SURFACES" on Jun 11, 2024. With publication no. WO/2025/255709, the details related to the patent application was published on Dec 18, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WANG, Xing (No. 300, Baiquijiang RoadQingpu District, Shanghai 201709), GU, Yufeng (HAIC, Building #4, No. 150 Gebaini Rd.Pud...