INTERNATIONAL PATENT: HENKEL AG & CO. KGAA, HENKEL (CHINA) INVESTMENT CO., LTD. FILES APPLICATION FOR "REACTIVE HOT-MELT ADHESIVE COMPOSITION AND USE THEREOF"

GENEVA, March 1 -- HENKEL AG & CO. KGAA (Henkelstrasse 67 40589 Duesseldorf), HENKEL (CHINA) INVESTMENT CO., LTD. (Floor 1, Building 7, No. 99 Jiangwancheng RoadYangpu District, Shanghai 200438) filed a patent application (PCT/CN2024/114112) for "REACTIVE HOT-MELT ADHESIVE COMPOSITION AND USE THEREOF" on Aug 23, 2024. With publication no. WO/2026/040069, the details related to the patent application was published on Feb 26, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ZHU, Lin (Room 1-105, No. 1180, Xin Huan Bei Rd. XinchangPudong New Area, Shanghai 201314), CHU, Huimin (No. 24, Lane 788,...