GENEVA, May 28 -- HENKEL AG & CO. KGAA (Henkelstrasse 6740589 Duesseldorf), CHAO, Jay (14000 Jamboree RdIrvine, California 92606) filed a patent application (PCT/US2024/056312) for "FLEXIBLE CONDUCTIVE ADHESIVE COMPOSITIONS" on Nov 16, 2024. With publication no. WO/2025/106944, the details related to the patent application was published on May 22, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ZHUO, Qizhuo (14000 Jamboree RdIrvine, California 92606), ZHANG, Jianfeng (14000 Jamboree RdIrvine, California 92606)
Abstract:
A conductive curable adhesive composition is useful for electronic pa...