International Patent: HEATING LAYER STRUCTURE, BAKING TRAY AND BASE OF BAKING TRAY

GENEVA, July 31 -- DOSOAI TECHNOLOGY (SHENZHEN) CO., LTD filed a patent application (CN2025/141832) for “HEATING LAYER STRUCTURE, BAKING TRAY AND BASE OF BAKING TRAY”. With publication no. WO/2026/157626, here are the other details related to the patent application:

Kind: Initial Publication with ISR [A1]

IPC: H05B 3/20

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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