GENEVA, May 19 -- HD MICROSYSTEMS, LTD. (1-6, Shinjuku 4-chome, Shinjuku-ku, Tokyo1600022), ＨＤマイクロシステムズ株式会社 (東京都新宿区新宿四丁目１番６号) filed a patent application (PCT/JP2024/040036) for "PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, PATTERNED CURED PRODUCT PRODUCTION METHOD, AND ELECTRONIC COMPONENT" on Nov 11, 2024. With publication no. WO/2026/100079, the details related to the patent application was published on May 15, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which ...