INTERNATIONAL PATENT: HANWHA SOLUTIONS CORPORATION, 한화솔루션 주식회사 FILES APPLICATION FOR "LOW-EXPANSION SILICON-CARBON COMPOSITE WITH IMPROVED ELECTRICAL CONDUCTIVITY, PREPARATION METHOD THEREFOR AND SILICON ANODE MATERIAL COMPRISING SAME"

GENEVA, Jan. 6 -- HANWHA SOLUTIONS CORPORATION (86, Cheonggyecheon-ro,Jung-gu,Seoul 04541), 한화솔루션 주식회사 (서울특별시중구청계천로 86) filed a patent application (PCT/KR2024/097112) for "LOW-EXPANSION SILICON-CARBON COMPOSITE WITH IMPROVED ELECTRICAL CONDUCTIVITY, PREPARATION METHOD THEREFOR, AND SILICON ANODE MATERIAL COMPRISING SAME" on Dec 18, 2024. With publication no. WO/2026/005164, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Proper...