GENEVA, April 29 -- HANSOL CHEMICAL CO.,LTD (7~8F, 513, Teheran-roGangnam-gu,Seoul 06169), 주식회사 한솔케미칼 (서울특별시강남구테헤란로 513, 7층,8층) filed a patent application (PCT/KR2025/016448) for "LIQUID EPOXY RESIN COMPOSITION FOR SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PACKAGE USING SAME" on Oct 17, 2025. With publication no. WO/2026/084504, the details related to the patent application was published on Apr 23, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

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