INTERNATIONAL PATENT: GUANGZHOU MEADVILLE ELECTRONICS COMPANY LIMITED, 广州美维电子有限公司 FILES APPLICATION FOR "METHOD FOR MANUFACTURING POWER CHIP SINTERING MODULE, POWER CHIP SINTERING MODULE AND CARRIER PLATE FIXTURE"

GENEVA, Feb. 16 -- GUANGZHOU MEADVILLE ELECTRONICS COMPANY LIMITED (No. 1 Xinle Road, Science City, Hi-Tech Industrial Development ZoneGuangzhou, Guangdong 510663), 广州美维电子有限公司 (中国广东省广州市高新技术产业开发区科学城新乐路一号) filed a patent application (PCT/CN2024/135076) for "METHOD FOR MANUFACTURING POWER CHIP SINTERING MODULE, POWER CHIP SINTERING MODULE AND CARRIER PLATE FIXTURE" on Nov 28, 2024. With publication no. WO/2026/031407, the details related to the patent application was published on Feb 12, 2026.

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