GENEVA, March 8 -- GUANGZHOU MEADVILLE ELECTRONICS COMPANY LIMITED (No. 1 Xinle Road, Science City, Hi-Tech Industrial Development ZoneGuangzhou, Guangdong 510663), 广州美维电子有限公司 (中国广东省广州市高新技术产业开发区科学城新乐路一号) filed a patent application (PCT/CN2024/135075) for "AUTOMOTIVE-GRADE CHIP PACKAGING METHOD AND PACKAGING STRUCTURE" on Nov 28, 2024. With publication no. WO/2026/044963, the details related to the patent application was published on Mar 05, 2026.
Notably, the patent application was submitted under t...