GENEVA, Feb. 16 -- GREATECH SUBSTRATES CO., LTD. (No. 1321, Zhixin Road, Huangpu DistrictGuangzhou, Guangdong 510700), 广州广芯封装基板有限公司 (中国广东省广州市黄埔区知新路1321号) filed a patent application (PCT/CN2025/095633) for "PROCESSING METHOD FOR SUBSTRATE HAVING SUPPORT STRUCTURE, AND CHIP PACKAGING STRUCTURE" on May 19, 2025. With publication no. WO/2026/031710, the details related to the patent application was published on Feb 12, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World...