GENEVA, Sept. 7 -- TANAKA ELECTRONICS CO., LTD. filed a patent application (JP2026/004740) for “GOLD ALLOY WIRE, GOLD BONDING WIRE USING THE SAME, CONDUCTIVE WIRE MATERIAL, WIRE MATERIAL FOR BONDING, WIRE MATERIAL FOR SEMICONDUCTOR, WIRE MATERIAL FOR STRUCTURE, WIRE MATERIAL FOR MEDICAL TREATMENT, AND WIRE MATERIAL FOR JEWELRY”. With publication no. WO/2026/181695, here are the other details related to the patent application:
Kind: Initial Publication with ISR [A1]
IPC: C22C 5/02
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
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