INTERNATIONAL PATENT: GLOBALWAFERS CO., LTD. FILES APPLICATION FOR "SYSTEMS AND METHODS FOR WAFER SHAPE CLASSIFICATION USING MACHINE LEARNING FOR WIRE SAW PROCESS CONTROL"

GENEVA, Feb. 11 -- GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial Park) filed a patent application (PCT/US2025/039624) for "SYSTEMS AND METHODS FOR WAFER SHAPE CLASSIFICATION USING MACHINE LEARNING FOR WIRE SAW PROCESS CONTROL" on Jul 29, 2025. With publication no. WO/2026/030291, the details related to the patent application was published on Feb 05, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LAURENZI, Andrea (c/o Memc Electronic Materials S.p.A.Viale Gherzi 3128100 Novara), BONDA, Fabrizio (c/o Memc Electronic Materials S.p.A.Viale Gherzi 3128100 Novara)...