INTERNATIONAL PATENT: GLOBALWAFERS CO., LTD. FILES APPLICATION FOR "METHODS TO ENHANCE AND CHARACTERIZE OXYGEN PRECIPITATION INDUCED DEFECTS DURING A WAFER POLISHING SEQUENCE"

GENEVA, Jan. 20 -- GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial ParkHsinchu City, 30075) filed a patent application (PCT/US2025/036619) for "METHODS TO ENHANCE AND CHARACTERIZE OXYGEN PRECIPITATION INDUCED DEFECTS DURING A WAFER POLISHING SEQUENCE" on Jul 07, 2025. With publication no. WO/2026/015437, the details related to the patent application was published on Jan 15, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LIN, Shan-Hui (c/o GlobalWafers Co., Ltd.No. 2, Creation Road 1Science-Based Industrial ParkHsinchu City, 30077), LU, Zheng (c/o MEMC LLC501 Pe...