INTERNATIONAL PATENT: GLOBALWAFERS CO., LTD., RUPRECHT, DAVID JOHN FILES APPLICATION FOR "SYSTEMS AND METHODS FOR ANALYZING SEMICONDUCTOR WAFER DEFECTS USING SURFACE INSPECTION TOOLS"

GENEVA, Jan. 27 -- GLOBALWAFERS CO., LTD. (No. 8, Industrial East Road 2Science-Based Industrial ParkHsinchu City, 30075), RUPRECHT, David John (c/o MEMC LLC501 Pearl DriveSt. Peters, Missouri 63376) filed a patent application (PCT/US2025/037980) for "SYSTEMS AND METHODS FOR ANALYZING SEMICONDUCTOR WAFER DEFECTS USING SURFACE INSPECTION TOOLS" on Jul 16, 2025. With publication no. WO/2026/019972, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TSAI, Cheng-Kun (c/o GlobalWafers Co., Ltd.No. 2, Creation Road 1Science-Based ...